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Nano Research

Article Title

Bestow metal foams with nanostructured surfaces via a convenient electrochemical method for improved device performance

Authors

Yawen Zhan, Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China
Shanshan Zeng, Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China
Haidong Bian, Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Department of Chemistry and Biology, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China
Zhe Li, Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China
Zhengtao Xu, Department of Chemistry and Biology, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China
Jian Lu, Department of Mechanical and Biomedical Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, 8 Yuexing 1st Road, Shenzhen Hi-Tech Industrial Park, Nanshan District, Shenzhen 518000, China
Yang Yang Li, Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, China City University of Hong Kong Shenzhen Research Institute, 8 Yuexing 1st Road, Shenzhen Hi-Tech Industrial Park, Nanshan District, Shenzhen 518000, China

Keywords

electrodeposition, dealloying, metal foams, surface enhanced Raman spectroscopy substrates, supercapacitors

Abstract

Metal foams have been intensively studied as three-dimensional (3-D) bulk mass-support for various applications because of their high conductivities and attractive mechanical properties. However, the relatively low surface area of conventional metal foams largely limits their performance in applications such as charge storage. Here, we present a convenient electrochemical method for addressing this problem using Cu foams as an example. High surface area Cu foams are fabricated in a one-pot one-step manner by repetitive electrodeposition and dealloying treatments. The obtained Cu foams exhibit greatly improved performance for different applications like surface enhanced Raman spectroscopy (SERS) substrates and 3-D bulk supercapacitor electrodes.

Graphical Abstract

Publisher

Tsinghua University Press

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