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Journal of Advanced Ceramics

Authors

Xiaowu CHEN, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
Guofeng CHENG, Analysis and Testing Center for Inorganic Materials, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
Junmin ZHANG, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China School of Physical Science and Technology, ShanghaiTech University, Shanghai 200031, China
Feiyu GUO, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China School of Physical Science and Technology, ShanghaiTech University, Shanghai 200031, China
Haijun ZHOU, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
Chunjin LIAO, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
Hongda WANG, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
Xiangyu ZHANG, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
Shaoming DONG, State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China Structural Ceramics and Composites Engineering Research Center, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China

Keywords

residual stress, nano-powder infiltration and transient eutectoid (NITE), Raman spectroscopy, mechanical properties

Abstract

Residual stress originated from thermal expansion mismatch determines the mechanical properties of ceramic matrix composites (CMCs). Here, continuous SiC fiber reinforced SiC matrix (SiCf/SiC) composites were fabricated by nano-infiltration and transient eutectic-phase (NITE) method, and the residual stress of the composites was investigated using high-temperature Raman spectrometer. With temperature increasing from room temperature to 1400 ℃, the residual stresses of the matrix and the fiber decrease from 1.29 to 0.62 GPa and from 0.84 to 0.55 GPa in compression respectively, while that of the interphase decreases from 0.16 to 0.10 GPa in tension. The variation of residual stress shows little effect on the tensile strength of the composites, while causes a slight decrease in the tensile strain. The suppression of fiber/matrix debonding and fiber pulling-out caused by the residual stress reduction in the interphase is responsible for the decreasing tensile strain. This work can open up new alternatives for residual stress analysis in CMCs.

Publisher

Tsinghua University Press

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