•  
  •  
 
Journal of Advanced Ceramics

Authors

Jiaxuan HUANG, School of Shaanxi University of Science and Technology, Xi’an 710021, China;Engineering Laboratory of Advanced Energy Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;Qianwan Institute of CNiTECH, Zhongchuangyi Road, Hangzhou Bay District, Ningbo 315336, China
Hujie WAN, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Mian LI, Engineering Laboratory of Advanced Energy Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;Qianwan Institute of CNiTECH, Zhongchuangyi Road, Hangzhou Bay District, Ningbo 315336, China
Yiming ZHANG, Engineering Laboratory of Advanced Energy Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;Qianwan Institute of CNiTECH, Zhongchuangyi Road, Hangzhou Bay District, Ningbo 315336, China
Jianfeng ZHU, School of Shaanxi University of Science and Technology, Xi’an 710021, China
Xuelin LI, School of Shaanxi University of Science and Technology, Xi’an 710021, China
Wenchao SHUI, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Yao LI, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Xiaomeng FAN, State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Qiye WEN, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Xu XIAO, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Qing HUANG, Engineering Laboratory of Advanced Energy Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;Qianwan Institute of CNiTECH, Zhongchuangyi Road, Hangzhou Bay District, Ningbo 315336, China

Keywords

MAX phases, biomimics, electromagnetic interference (EMI), terahertz shielding

Abstract

Electromagnetic interference (EMI) shielding materials have received considerable attention in recent years. The EMI shielding effectiveness (SE) of materials depends on not only their composition but also their microstructures. Among various microstructure prototypes, porous structures provide the advantages of low density and high terahertz wave absorption. In this study, by using carbonised wood (CW) as a template, 1-mm-thick MAX@CW composites (Ti2AlC@CW, V2AlC@CW, and Cr2AlC@CW) with a porous structure were fabricated through the molten salt method. The MAX@CW composites led to the formation of a conductive network and multilayer interface, which resulted in improved EMI SE. The average EMI SE values of the three MAX@CW composites were > 45 dB in the frequency of 0.6-1.6 THz. Among the composites, V2AlC@CW exhibited the highest average EMI SE of 55 dB.

Share

COinS