"Spatial evolution of friction of a textured wafer surface" by Huaping XIAO, Ke WANG et al.

Article Title

Spatial evolution of friction of a textured wafer surface

Authors

Huaping XIAO, Mechanical Engineering, Texas A&M University, College Station, Texas 77843, USA
Ke WANG, Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA
Grant FOX, Mechanical Engineering, Texas A&M University, College Station, Texas 77843, USA
Michel BELIN, Ecole Centrale de Lyon/CNRS-UMR 5513, France
Julien FONTAINE, Ecole Centrale de Lyon/CNRS-UMR 5513, France
Hong LIANG, Mechanical Engineering, Texas A&M University, College Station, Texas 77843, USA Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA

Keywords

micro-electro-mechanical systems (MEMS), patterned wafers, friction, transfer wear, electrical contact resistance

Abstract

Mechanical failure of integrated circuits and micro-electro-mechanical systems (MEMS) demands new understanding of friction in small devices. In present research, we demonstrated an in situ approach to measure sliding friction of a patterned surface composing multi-materials and structures. The effects of materials and surface morphology on friction and electrical contact resistance were investigated. The material transfer at the interface of dissimilar materials was found to play dominating roles in friction. The current work provides important insights from the fundamentals of friction that benefit the design of new micro-devices.